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Serial Digital Interfaces

A family of digital video interfaces standardized by SMPTE.


Showing results: 466 - 476 of 476 items found.

  • USB to RS-422/RS-485 Converter

    ND-6530 - ADLINK Technology Inc.

    ADLINK's NuDAM data acquisition modules make up a total acquisition network and control system. Up to 256 NuDAM modules an be romotely controlled on any RS-485 network from a host computer, via a single serial RS-232, allowing communication from as far as 4000 feet from the host. Based on the RS-485 multi-drop network system, each module has a unique address ID, whereby simple ASCII command & response protocols through the standard RS-485 interface can control all the NuDAM modules in the RS-485 network. The NuDAM modules provide direct communications with a wide variety of sensors, perform all signal conditioning, scaling, linearization and conversion, and can acquire measurements of temperature, pressure, flow, voltage, current, and multiple digital signal types.

  • Isolated LVDS

    Analog Devices Inc.

    Isolated LVDS (low voltage differential signaling) devices couple differential signals applied to the LVDS receiver inputs across the isolation barrier to the outputs on the other side and re-transmits the bit stream or clock as LVDS. Analog Devices' drop-in LVDS isolators offer designers robust, high speed differential signaling for point-to-point and multidrop applications. Extending iCoupler® chip scale transformer technology for ultrahigh speed data encoding, these LVDS isolators support a a data rate of up to 2.5 Gigabits per channel for a total bandwidth of 10 Gbps. In contrast to expensive fiber implementations, deserialized links over standard digital isolators or optocouplers, and design-intensive bespoke solutions using transformers or high voltage capacitors, ADI Gigabit Digital LVDS isolators offer the only integrated comprehensive, high performance isolation at 10 Gbps. High performance galvanic isolation for applications include analog front-end (AFE), processor to processor serial communication, or video and imaging data (such as HDMI isolators) as well as isolation between boards, or at a cable interface for LVDS or CML signal chains.

  • High Speed Digital Analog

    JGB Consulting, Inc.

    The Automatic Test Equipment is designed to provide R&D and the Production floor with a high quality, reliable and easy to use Test Station comprised of COTS equipment from industry leading instrument manufactures. The measurement switching has low thermal offset allowing for micro volt measurements. The switching also accommodates both stimulus and measurement up to 5 Amps. Also to provide High Speed and Static Digital Stimulus and Response that covers LVDS, 3.3V, TTL, CMOS and Industrial logic families. For Serial communications there are SPI, I2C, RS232/485, USB and Ethernet. The system has nine programmable DC power supplies that are capable of powering both the UUT and the UUT interface separately. The system can interface with a variety of UUT’s via an ITA. Each system comes with the Imperial Test Executive, National Instruments TestStand, CVI, LabView and .NET Runtime.

  • 3-Ch 200 MHz A/D with DDC & 2-Ch 800 MHz D/A with DUC, Kintex UltraScale - XMC

    Model 71821 - Pentek, Inc.

    - Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Exceptional dynamic range and analog signal integrity- Xilinx® Kintex® UltraScale" FPGA- Three 200 MHz 16-bit A/Ds- Three multiband DDCs (digital downconverters)- One DUC (digital upconverter)- Two 800 MHz 16-bit D/As- 5 GB of 2400 MHz DDR4 SDRAM- Programmable frequency synthesized sample clock generator- Sample clock synchronization to an external system reference- Powerful DMA controllers for moving data- PCI Express (Gen. 1, 2 & 3) interface up to x8- Multi-channel synchronization with clock/sync bus- Optional clock/sync generator for multi-board systems- Optional LVDS port for custom FPGA I/O- Optional gigabit serial links for custom FPGA I/O- Ruggedized and conduction-cooled versions available- Navigator® BSP for software development- Navigator® FDK for custom IP development- SPARK® fully-integrated development system- Free lifetime applications support- Synchronize up to eight modules with Model 7893 System Synchronization and Distribution Amplifier - PCIe

  • L-Band RF Tuner and 2-Channel 400 MHz A/D with Kintex UltraScale FPGA - 3U VPX

    Model 54891 - Pentek, Inc.

    - Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Accepts RF signals from 925 MHz to 2175 MHz- Programmable LNA handles L-Band input signal levels from -50 dBm to + 10 dBm- Programmable analog downconverter provides IF or I+Q baseband signals at frequencies up to 123 MHz- Two 400 MHz 12-bit A/Ds digitize IF or I+Q signals synchronously- Two FPGA-based multiband DDCs (digital downconverters)- Xilinx® Kintex® UltraScale™ FPGA- Five GB of DDR4 SDRAM- Sample clock synchronization to an external system reference- PCI Express interface (Gen. 1, 2 & 3) up to x8- Clock/sync bus for multimodule synchronization- Optional LVDS and gigabit serial connections for FPGA for custom I/O- Optional optical interface for data streaming- Navigator BSP® for software development- Navigator FDK® for custom IP development- Spark® fully-integrated development system- Free lifetime applications support- Synchronize up to eight modules with Model 7893 System Synchronization and Distribution Amplifier - PCIe

  • Robust RISC-based DIN-rail Fanless Embedded System With I.MX 6UL Processor, COM, SPI, I2C, 2 LANs And DIO (2-in/1-out)

    IFB125 - Axiomtek Co., Ltd.

    The IFB125 is powered by the low-power Freescale i.MX6UL processor in the ARM® Cortex™-A7 micro architecture. It supports extended operating temperature ranging from -40°C to 70°C, and can withstand vibration up to 5G. Its flexible wide voltage range 9V - 48V DC power input with a lockable terminal block type connector also enhances its reliability in harsh environments. To meet most of Industrial IoT needs, the IFB125 supports multiple communication interfaces for maximum flexibility, including LAN, serial, USB, and digital I/O ports. The Industrial IoT gateway has 256MB onboard memory that features data transfer rates of DDR3-1600, as well as 4GB eMMC flash memory onboard for storage. This embedded IoT gateway platform is equipped with one PCI Express Mini Card slot and one SIM card slot. Additionally, it supports DB9 connectors with both SPI and I2C function as communication protocols to suit for specific applications

  • L-Band RF Tuner and 2-Channel 400 MHz A/D with Kintex UltraScale FPGA - 6U VPX

    Model 57891 - Pentek, Inc.

    - Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Accepts RF signals from 925 MHz to 2175 MHz- Programmable LNA handles L-Band input signal levels from -50 dBm to + 10 dBm- Programmable analog downconverter provides IF or I+Q baseband signals at frequencies up to 123 MHz- Two 400 MHz 12-bit A/Ds digitize IF or I+Q signals synchronously- Two FPGA-based multiband DDCs (digital downconverters)- Xilinx® Kintex® UltraScale™ FPGA- Five GB of DDR4 SDRAM- Sample clock synchronization to an external system reference- PCI Express interface (Gen. 1, 2 & 3) up to x8- Clock/sync bus for multimodule synchronization- Optional LVDS and gigabit serial connections for FPGA for custom I/O- Navigator BSP® for software development- Navigator FDK® for custom IP development- Spark® fully-integrated development system- Free lifetime applications support- Synchronize up to eight modules with Model 7893 System Synchronization and Distribution Amplifier - PCIe

  • L-Band RF Tuner and 2-Channel 400 MHz A/D with Kintex UltraScale FPGA - XMC

    Model 71891 - Pentek, Inc.

    - Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Accepts RF signals from 925 MHz to 2175 MHz- Programmable LNA handles L-Band input signal levels from -50 dBm to + 10 dBm- Programmable analog downconverter provides IF or I+Q baseband signals at frequencies up to 123 MHz- Two 400 MHz 12-bit A/Ds digitize IF or I+Q signals synchronously- Two FPGA-based multiband DDCs (digital downconverters)- Xilinx® Kintex® UltraScale™ FPGA- Five GB of DDR4 SDRAM- Sample clock synchronization to an external system reference- PCI Express interface (Gen. 1, 2 & 3) up to x8- Clock/sync bus for multimodule synchronization- Optional LVDS and gigabit serial connections for FPGA for custom I/O- Navigator BSP® for software development- Navigator FDK® for custom IP development- Free lifetime applications support- Synchronize up to eight modules with Model 7893 System Synchronization and Distribution Amplifier - PCIe

  • Dual-Band RF Tuner and 4-Ch 400 MHz A/D with Kintex UltraScale FPGA - 6U VPX

    Model 58891 - Pentek, Inc.

    - Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Accepts RF signals from 925 MHz to 2175 MHz- Programmable LNA handles L-Band input signal levels from -50 dBm to + 10 dBm- Programmable analog downconverter provides IF or I+Q baseband signals at frequencies up to 123 MHz- Four 400 MHz 12-bit A/Ds digitize IF or I+Q signals synchronously- Four FPGA-based multiband DDCs (digital downconverters)- Two Xilinx® Kintex® UltraScale™ FPGA- 10 GB of DDR4 SDRAM- Sample clock synchronization to an external system reference- PCI Express interface (Gen. 1, 2 & 3) up to x8- Clock/sync bus for multimodule synchronization- Optional LVDS and gigabit serial connections for FPGA for custom I/O- Navigator BSP® for software development- Navigator FDK® for custom IP development- Spark® fully-integrated development system- Free lifetime applications support- Synchronize up to eight modules with Model 7893 System Synchronization and Distribution Amplifier - PCIe

  • OpenVPX CPU Blade with 4th Generation Intel® Core™ Processor

    MIC-6311 - Advantech Co. Ltd.

    Advantech’s MIC-6311 is a single processor VPX blade based on the 4th generation Intel® Core™ i3/i5/i7 platform. It enables the highest performance available in 6U VPX form factor with two SRIOx4 ports in the VPX data plane and two PCI Express x8 gen. 3 lanes in the VPX expansion plane for workstation and compute intense applications. The two Serial RapidIO ports offer the possibility to interface the MIC-6311 to digital front ends such as DSP and FPGA cards via a high speed, low latency deterministic interconnect. In addition, PCI Express ports with up to 8GB/s throughput offer a high performance interface to mainstream peripherals and IO cards. With a SO-DIMM socket and additional soldered, onboard DRAM with ECC in a dual channel design running up to 1600MT/s, the MIC-6311 offers the ability to fit harsh environments while maintaining maximum memory throughput and supporting memory expansion using the latest SO DIMM technology. Moreover, the 4th generation Intel® Core™ processors offer increased cache size and efficiency as well as instruction set improvements which make the MIC-6311 a high performance compute engine with outstanding floating point and vector processing performance. Tailored for rugged environments, MIC-6311 has been designed to support ruggedized convection cooled heat sinks. Additionally, it implements an onboard soldered, industrial SSD for maximum reliability. By using the latest powerful PCH (Lynx Point) from Intel®, with its advanced SATA controller advanced storage options are supported such as a 2.5" SATA III HDD/SSD socket offering high storage capacity with up to 6Gbps transfer speed. A CFast socket provides an alternative for implementing a cost efficient, pluggable SSD. An onboard XMC/PMC site with PCIe x8 gen.3 connectivity can host high speed offload or I/O mezzanines. Two USB 3.0 ports in front panel can connect to the external devices with up to 5Gbps data rate. Network and remote connectivity can be achieved via a RS232 console (RJ45) and two GbE RJ45 ports, powered by Intel®’s latest Gigabit Ethernet Controiller, the i350. The processor’s integrated enhanced graphics engine Iris offers up to 2x the graphic performance compared to previous generation solutions. Triple independent display support can be implemented by using the MIC-6311’s VGA front panel port and two Display port / HDMI interfaces on rear transition modules. Audio port support via the backplane interface enhances media support. Three SATA ports (SATAIII) and four USB ports (2x USB 3.0, 2x USB 3.0) are also connected to backplane to fulfill the demand for extra IO ports or storage. Two GbE/ SERDES ports support system level IP connectivity and two UART interfaces can be leveraged to interface to legacy devices and consoles.

  • OpenVPX CPU Blade with 4th/ 5th Generation Intel® Core™ Processor

    MIC-6313 - Advantech Co. Ltd.

    The MIC-6313 is Advantech’s next generation single processor 6U VPX blade, based on the 4th/ 5th Generation Intel® Core™ and Intel® Xeon® Processor E3 Lv4 embedded platform. To enable the highest performance available in the 6U VPX form factor for workstation and compute intense applications, the four Serial RapidIO ports in the VPX data plane offer high speed up to 5Gb/s, low latency, scalable, error recoverable deterministic interconnectivity to digital front ends such as DSP and FPGA cards. In addition, two PCI Express ports x8 lanes in the VPX expansion plane, with up to PCI Express gen. 2 (5Gb/s) throughput offer a high performance interface to mainstream peripherals and I/O cards. With a SO-DIMM socket and additional soldered, onboard DRAM with ECC in a dual channel design running up to 1600MT/s, the MIC-6313 can be integrated into various harsh environments while maintaining maximum memory throughput, and supports memory expansion by using the latest SO-DIMM technology simultaneously. In addition, the 4th/ 5th generation Intel® Core™ and Xeon® E3 Lv4 embedded processors offer increased cache size and efficiency, as well as instruction set improvements, which make the MIC-6313 a high performance compute engine with outstanding floating point and vector processing performance. Tailored for harsh environments, the MIC-6313 has a native ruggedized convection cooled heat sink adaptable to various chassis environments; with the alternative optional air cooled heat sink, additional I/O is provided on the front panel. An onboard soldered, industrial SSD is included for maximum reliability, and a CFast/ SSD socket is also available for a costefficient, modular storage. By using Intel®’s powerful PCH (Lynx Point) with its advanced SATA controller, the MIC-6313 offers high storage capacity at up to 6Gbps transfer speed. An onboard XMC site with PCIe x8 gen.3 connectivity can host high speed offload or I/O mezzanines. Two USB 3.0 ports on the front panel can connect to external devices with up to 5Gbps data rate. Network and remote connectivity can be achieved via a RS-232 console (RJ-45) and two GbE RJ-45 ports, powered by Intel®’s latest Gigabit Ethernet controller. The next generation graphics engine Intel® Iris Pro offers up to 2x the graphic performance compared to previous generation solutions. Triple independent display support can be implemented by using the MIC-6313’s DVI front panel port and two DVI interfaces on rear transition modules. Audio is powered by a ALC892 controller via the backplane interface, and provides media support. Four SATA ports (SATAIII) and four USB ports (2x USB 3.0, 2x USB 3.0) are also connected to the backplane to fulfill the demand for extra IO ports or storage. Four GbE ports (two SERDES selectable) support system level IP connectivity, and four UART interfaces (RS232/422/485 selectable) can be leveraged to interface to legacy devices and consoles.

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